Keokeo corundum profile one capacitive alumina refractory tripartite crystal system
Korundum keʻokeʻo
He aha ke ʻano nui o ke one corundum keʻokeʻo nui i hoʻohana ʻia no nā mea polishing?
Hoʻokaʻawale ʻia ka corundum keʻokeʻo i ka poloka corundum keʻokeʻo, ke one ʻāpana corundum keʻokeʻo, ke one nui o ka corundum keʻokeʻo a me ka pauka maikaʻi.
Hana ʻia ke one ʻāpana corundum keʻokeʻo ma o ka hoʻohana ʻana i nā poloka corundum keʻokeʻo kiʻekiʻe ma o nā kaʻina like ʻole e like me ka ʻoki ʻana, ka hoʻohu ʻana a me ka nānā ʻana.ʻO ke one ʻāpana corundum keʻokeʻo nā hiʻohiʻona o ka waika a me ka alkali corrosion kū'ē a me ka paʻakikī kiʻekiʻe.
Nā hiʻohiʻona: keʻokeʻo, ʻoi aku ka paʻakikī a ʻoi aku ka palupalu ma mua o ka corundum brown, ikaika ʻoki ikaika, kūpaʻa kemika maikaʻi, a me ka insulation maikaʻi.Loaʻa iā ia nā hiʻohiʻona o ka maʻemaʻe kiʻekiʻe, ka paʻakikī maikaʻi, a me ke kūpaʻa paʻa ikaika, no laila hoʻohana pinepine ʻia e like me ka abrasive, a hoʻohana pū ʻia no ka maikaʻi a me ka wili ʻana i ke kila kila a me nā mea ʻē aʻe.
Nā kuhikuhina kemika o ka corundum keʻokeʻo
| Kemika haku mele | AL2O3% | SiO2% | Fe2o3% | Na2O% | LOI% | Volume mānoanoa/cm3 |
| Keʻokeʻo helu helu corundum | ≥99.5% | ≤0.1% | ≤0.1% | ≤0.35% | 0.1 | 3.50 |
| ʻO ka pauka corundum keʻokeʻo | ≥99.5% | ≤0.1% | ≤0.1% | ≤0.35% | 0.1 | 3.50 |
Hana ʻia ka corundum keʻokeʻo i ka pauka alumina kiʻekiʻe, a ʻoi aku ka mahana o ka hoʻoheheʻe ʻana ma mua o 2000 degere.Loaʻa iā ia ka maʻemaʻe kiʻekiʻe, ʻoi aku ka maikaʻi o ka hoʻomaʻamaʻa ponoʻī, ka waika a me ka alkali corrosion kūpaʻa, kiʻekiʻe wela kūʻokoʻa a paʻa thermal hana.ʻOi aku ke kiʻekiʻe o ka paʻakikī ma mua o ka corundum brown, a ʻoi aku ka haʻahaʻa o ka paʻakikī ma mua o ka corundum brown.ʻO ka paʻakikī kiʻekiʻe, kiʻekiʻe ka nui o ka ʻāpana, maikaʻi ka pōʻai ʻāpana, kala: keʻokeʻo, ʻaʻohe haumia, e hōʻoia i ka waihoʻoluʻu a me ka ʻike o ka ʻaʻahu a i ʻole ka pepa ʻaʻahu kūʻokoʻa, ka hāʻawi like ʻana i ka nui o ka nui, ke ʻano like ʻole o ka ʻāpana hoʻokahi, me ʻo ka liʻiliʻi liʻiliʻi hiki ke pale ʻia ʻo Abrasion.
1. Liquid polishing: Liquid polishing e pili ana i ke kahe kiʻekiʻe o ka wai a me ka erosion o ka ʻili o ka mea hana me ka corundum grit keʻokeʻo e hoʻokō i ke kumu o ka polishing.
ʻO nā ʻano hana maʻamau: ʻo ka hoʻoheheʻe ʻana i ke one daimana, ka hoʻoheheʻe ʻana i ka wai.Hoʻohana ʻia ka wili ʻana o ka wai i ka hydraulically, e ʻae ana i ka wai wai e lawe ana i nā ʻāpana abrasive corundum keʻokeʻo e kahe i hope a i waho me ka wikiwiki kiʻekiʻe ma ka ʻili o ka mea hana ma o ka pū sandblasting.Hana nui ʻia ka wai wai i nā pūhui kūikawā, maikaʻi ka wai ma lalo o ke kaomi haʻahaʻa, a hui pū ʻia me ka pauka corundum keʻokeʻo.
2. Mechanical polishing: Mechanical polishing e pili ana i kahi hana polishing e wehe ai i ka ʻāpana convex o ka mea polishing mai ka deformation plastic o ka ʻoki ʻoki.ʻO ka mea maʻamau, hana nui ʻia ke kiʻi polishing e ka lima.Hiki i nā ʻāpana kūikawā e like me ka hoʻololi ʻana i nā papa ke hoʻohana i nā mea kōkua e like me nā turntables, a me ka ultra-precision polishing hiki ke hoʻohana i nā ʻano polishing kiʻekiʻe.
3. ʻO ka hoʻomaʻamaʻa kemika: ʻO ka polishing kemika e hoʻoheheʻe ʻia ka ʻāpana micro-protruding o ka ʻili mea i loko o ke kinikini ma mua o ka ʻili concave, i mea e loaʻa ai ka ʻili maʻemaʻe.ʻO ka pōmaikaʻi nui o kēia ʻano hana, ʻo ia ka hiki ke hoʻoliʻi i nā mea hana me nā ʻano paʻakikī me ka ʻole o nā mea paʻakikī, a hiki ke hoʻoliʻi i nā mea hana he nui i ka manawa like, a ʻoi aku ka maikaʻi o ka hana.
4. Mākēneki wili a me ka polishing: Magnetic green silicon carbide ua hoʻohana 'ia no ka magnetic wili a me ka polishing e hana i keʻokeʻo corundum one ma lalo o ka hana o ka magnetic field.Loaʻa i ke ala ka maikaʻi o ka hana kiʻekiʻe kiʻekiʻe, ka maikaʻi maikaʻi, ka mana maʻalahi o nā kūlana hana a me nā kūlana hana maikaʻi.
